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| 000 | 00964pam a2200265 4500 | ||
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| 003 | MY-WpKST | ||
| 005 | 20210908065331.0 | ||
| 007 | OC | ||
| 008 | 131204s2013####nyuagr#001#0#eng#d | ||
| 020 | _a852960395 | ||
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| 040 | _aMOSTI | ||
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_a621.38152 _bSIL |
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| 245 | 1 | 0 |
_aSilicon wafer bonding technology _cedited by Subramanian S. Iyer and Andre J. Auberton-Herve� |
| 260 |
_aLondon _bInstitution of Electrical Engineers _cc2002 |
||
| 300 |
_axxv, 149 p. _bill. _c26 cm |
||
| 504 | _aIncludes bibliographical references and index | ||
| 942 | _cBK | ||
| 999 |
_c10131 _d10131 |
||