Subcontract IC packaging industry in Malaysia 1999
Material type:
TextPublication details: Kuala Lumpur Malaysian Technology Development CorporationDescription: 30 p. ill(col) 30 cmISBN: - T000003786
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MOSTI Library Open shelf | Open Collection | 621.381096 SUB (Browse shelf(Opens below)) | Available | 007609 |
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| 621.381045 ROS optoelectronics | 621.381092 BER The man behind the microchip | 621.381096 MEL MIEE 2003 | 621.381096 SUB Subcontract IC packaging industry in Malaysia 1999 | 621.3815 HAN Handbook of nanostructured thin films and coatings: | 621.3815 HOF Reactive power compensation: a practical guide/ | 621.3815 PRO Proceedings of the 1st National conference on electronic design: |
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